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PC925L0NSZ0F series 1 sheet no.: d4-a09301en date sep. 01. 2006 ? sharp corporation notice the content of data sheet is subject to change without prior notice. in the absence of con rmation by device speci cation sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device speci cation sheets before using any sharp device. PC925L0NSZ0F series high speed, 2.5a output, gate drive dip 8 pin ? opic photocoupler description PC925L0NSZ0F series contains a led optically cou- pled to an opic chip. it is packaged in a 8 pin dip, available in smt gullwing lead form option. peak output current is 2.5a, input-output isolation voltage(rms) is 5kv and high speed response (t phl , t plh : max. 0.5 s). features 1. 8 pin dip package 2. double transfer mold package (ideal for flow soldering) 3. built-in direct drive circuit for mosfet / igbt drive (i o(peak) : 2.5a) 4. high speed response (t phl , t plh : max. 0.5 s) 5. wide operating supply voltage range (v cc = 15 to 30 v) 6. high noise immunity due to high instantaneous com- mon mode rejection voltage (cm h : min. ? 15kv/ s, cm l : min. 15kv/ s) 7. long creepage distance type (wide lead-form type only : min. 8mm) 8. high isolation voltage between input and output (v iso(rms) : 5kv) 9. lead-free and rohs directive compliant agency approvals/compliance 1. recognized by ul1577 (double protection isolation), le no. e64380 (as model no. pc925l ) 2. package resin : ul ammability grade (94v-0) applications 1. igbt/mosfet gate drive for inverter control * "opic"(optical ic) is a trademark of the sharp corporation. an opic consists of a light-detecting element and a signal-pro- cessing circuit integrated onto a single chip.
2 sheet no.: d4-a09301en PC925L0NSZ0F series pc925l primary side mark date code sharp mark "s" 2.54 0.25 8 7 6 5 6.5 0.3 0.6 0.2 rank mark 1.2 0.3 9.66 0.30 3.5 0.5 0.5 0.1 0.5 typ. 1 2 3 4 3.25 0.05 : 5 ? typ. 7.62 0.30 0.26 0.10 epoxy resin primary side mark pc925l sharp mark "s" 0.6 0.2 1.2 0.3 7 8 6 5 4 6.5 0.3 1 2 3 2.54 0.25 3.5 0.5 1.0 + 0.4 ? 0 0.26 0.10 epoxy resin 10.0 + 0 ? 0.5 1.0 + 0.4 ? 0 0.35 0.25 7.62 0.30 9.66 0.30 date code rank mark internal connection diagram outline dimensions 1. through-hole [ex. PC925L0NSZ0F ] 2. smt gullwing lead-form [ex. pc925l0nip0f ] (unit : mm) product mass : approx. 0.51g product mass : approx. 0.55g 8 7 6 5 1 2 3 4 1 2 3 4 5 6 7 8 interface amp. n.c. anode cathode n.c. v o gnd v o v cc truth table input v o terminal output tr1 tr2 on high level on off off low level off on
3 sheet no.: d4-a09301en PC925L0NSZ0F series pc925l 7.62 0.30 0.75 0.25 0.26 0.10 0.25 0.25 0.75 0.25 10.16 0.50 12.0 max. 9.66 0.30 epoxy resin 2.54 0.25 3.5 0.5 6.5 0.3 0.6 0.2 1.2 0.3 primary side mark date code sharp mark "s" 1 2 3 6 5 8 7 4 rank mark 3. wide smt gullwing lead-form [ex. pc925l0nup0f ] (unit : mm) product mass : approx. 0.55g plating material : pd (au ash)
4 sheet no.: d4-a09301en PC925L0NSZ0F series repeats in a 20 year cycle 1st digit 2nd digit 3rd digit year of production month of production week of production a.d. mark a.d. mark month mark week mark 1990 a 2002 p january 1 1st 1 1991 b 2003 r february 2 2nd 2 1992 c 2004 s march 3 3rd 3 1993 d 2005 t april 4 4th 4 1994 e 2006 u may 5 5, 6th 5 1995 f 2007 v june 6 1996 h 2008 w july 7 1997 j 2009 x august 8 1998 k 2010 a september 9 1999 l 2011 b october o 2000 m 2012 c november n 2001 n : : december d date code (3 digit) rank mark with or without. factory identi cation mark country of origin no mark japan or indonesia china * this factory marking is for identi cation purpose only. please contact the local sharp sales representative to see the actural status of the production. factory identi cation mark
5 sheet no.: d4-a09301en PC925L0NSZ0F series absolute maximum ratings (t a = 25 ? c) parameter symbol rating unit input *1 forward current i f 25 ma reverse voltage v r 5v *2 peak forward current i fm 1a output supply voltage v cc 35 v *3 peak output current i o(peak) 2.5 a output voltage v o v cc v *4 output power dissipation p o 250 mw *5 total power dissipation p tot 295 mw *6 isolation voltage v iso(rms) 5kv operating temperature t opr ? 40 to + 100 ? c storage temperature t stg ? 55 to + 125 ? c *7 soldering temperature t sol 270 ? c *1 when ambient temperature goes above 70 ? c, the power dissipation goes down at 0.3ma/ ? c (refer to fig.10). *2 pulse width 1 s, 300pps *3 pulse width 10 s, duty ratio : 0.002 *4 when ambient temperature goes above 70 ? c, the power dissipation goes down at 4.8ma/ ? c (refer to fig.11). *5 when ambient temperature goes above 70 ? c, the power dissipation goes down at 5.4ma/ ? c (refer to fig.12). *6 ac for 1min, 40 to 60%rh, f = 60hz *7 for 10s
6 sheet no.: d4-a09301en PC925L0NSZ0F series electro-optical characteristics *8 (unless otherwise speci ed : t a = ? + 40 to + 100 ? c, i f(on) = 7 to 16ma, v cc = 15 to 30v, v f(off) = ? 3v to 0.8v) parameter symbol condition min. *13 typ. max. unit input forward voltage v f i f = 10ma 1.2 ? 1.8 v reverse current i r v r = 5v ?? 10 a terminal capacitance c t t a = 25 ? c, v = 0, f = 1mhz ? 60 150 pf output high level output current i oh *8 v o = (v cc ? 4v), i f(on) 0.5 1.5 ? a *9 v o = (v cc ? 15v), i f(on) 2 ?? a low level output current i ol *8 v o = 2.5v, v f(off) 0.5 1.5 ? a *9 v o = 15v, v f(off) 2 ?? a high level output voltage v oh i o = ? 0.1a, i f(on) v cc ? 4v cc ? 3 ? v low level output voltage v ol i o = 0.1a, v f(off) ? 0.1 0.5 v *10 high level supply current i cch i f(on) ? 2.5 5 ma *10 low level supply current i ccl v f(off) ? 2.5 5 ma uvlo threshold v uvlo + v o >5v, i f = 10ma 11 12.3 13.5 v v uvlo ? 9.5 10.7 12 v uvlo hysteresis uvlo hys ? 1.6 ? v transfer characteristics *11 "low high" threshold input current i flh v o >5v, i o = 0 ?? 5ma isolation resistance r iso t a = 25 ? c, dc = 500v, 40 to 60%rh 510 10 10 11 ? response time "low high" propagation time t plh r g = 10 , c g = 10nf, f = 10khz, duty ratio 50% 0.1 0.3 0.5 s "high low" propagation time t phl 0.1 0.3 0.5 s *12 distortion of pulse width t w ?? 0.3 s propagation delay skew t psk ? 0.35 ? 0.35 s rise time t r ? 0.1 ? s fall time t f ? 0.1 ? s uvlo turn on delay t uvlo on v o >5v, i f = 10ma ? 0.8 ? s uvlo turn off delay t uvlo off v o >5v, i f = 10ma ? 0.6 ? s instantaneous common mode rejection voltage (high level output) |cm h | t a = 25 ? c , v cm = 1.5kv(p ? p) , i f = 10 to 16ma , v cc = 30v , v oh >15v 15 ?? kv/ s instantaneous common mode rejection voltage (low level output) |cm l | t a = 25 ? c, v cm = 1.5kv(p ? p), v f = 0, v cc = 30v, v ol <1v 15 ? ? kv/ s *7 it shall connect a by-pass capacitor of 0.1 f or more between v cc (pin no. 8) and gnd (pin no. 5) near the device, when it measures the transfer characteristics and the output side characteristics. *8 pulse width 50 s, duty ratio : 0.005 *9 pulse width 10 s, duty ratio : 0.002 *10 output pin is open. *11 i flh is the value of forward current when output becomes from "l" to "h" *12 distortion of pulse width t w = |t phl -t plh | *13 all typical values are at t a = 25 ? c, v cc = 30v
7 sheet no.: d4-a09301en PC925L0NSZ0F series model line-up lead form through-hole smt gullwing wide smt gullwing package sleeve taping 50 pcs/sleeve 1 000 pcs/reel model no. PC925L0NSZ0F pc925l0nip0f pc925l0nup0f
8 sheet no.: d4-a09301en PC925L0NSZ0F series fig.5 t est circuit for high level / low level supply current fig.6 test circuit for uvlo threshold fig.3 test circuit for high level output voltage fig.4 test circuit for low level output voltage fig.1 test circuit for high level output current fig.2 test circuit for low level output current i f i oh pc925l v cc 2 3 8 7 6 5 a i ol pc925l v cc 2 3 8 7 6 5 a i f i o v oh pc925l v cc 2 3 8 7 6 5 v i ol v ol pc925l v cc 2 3 8 7 6 5 v i f i cc pc925l v cc 2 3 8 7 6 5 a i f v o >5v pc925l v cc 2 3 8 7 6 5 v variable
9 sheet no.: d4-a09301en PC925L0NSZ0F series fig.7 t est circuit for "low high" input threshold current fig.8 t est circuit for response time fig.9 t est circuit for instantaneous common mode rejection voltage i f variable v o pc925l v cc 2 3 8 7 6 5 v v cc c g r g v out v in duty ratio 50% v in wave form v out wave form t plh t phl 50% 90% 50% 10% t r t f 10khz 2 3 8 7 6 5 pc925l v sw b a gnd gnd v cc v o + ? v cm v cm (peak) v cm wave form v oh v ol cm h , v o wave form sw at a, i f = 10 to 16ma cm l , v o wave form sw at b, i f = 0 2 3 8 7 6 5 pc925l
10 sheet no.: d4-a09301en PC925L0NSZ0F series fig.14 high level output voltage drop vs. ambient temperature fig.15 high level output voltage drop vs. supply voltage fig.12 total power dissipation vs. ambient temperature fig.13 forward current vs. forward voltage fig.10 forward currenet vs. ambient temperature fig.11 power dissipation vs. ambient temperature 0 5 10 15 20 25 30 forward current i f (ma) ambient temperature t a ( ? c) ? 50 ? 40 ? 25 050 25 125 100 75 70 output power dissipation p o (mw) 50 100 150 200 250 300 0 ? 50 ? 40 ? 25 050 25 125 100 75 70 ambient temperature t a ( ? c) total power dissipation p tot (mw) 50 100 150 200 250 350 300 295 ambient temperature t a ( ? c) 0 ? 50 ? 40 ? 25 050 25 125 100 75 70 0.1 10 1 100 1.2 1 1.4 1.6 1.8 2 forward current i f (ma) forward voltage v f (v) t a = 50 ? c t a = 25 ? c t a = 100 ? c t a = ? 40 ? c t a = 0 ? c high level output voltage drop v oh ? v cc (v) ? 2.5 ? 3 ? 3.5 ? 2 ? 1.5 ? 1 ? 0.5 0 ? 4 ? 40 ? 20 0 40 20 100 80 60 ambient temperature t a ( ? c) i f = 10ma, i o = 0.1a, v cc = 30v high level output voltage drop v oh ? v cc (v) ? 2.5 ? 3 ? 3.5 ? 2 ? 1.5 ? 1 ? 0.5 0 ? 4 15 20 30 25 supply voltage v cc (v) t a = 25 ? c, i f = 10ma, i o = 0.1a
11 sheet no.: d4-a09301en PC925L0NSZ0F series fig.20 low level supply current vs. ambient temperature fig.21 low level supply current vs. supply voltage fig.18 high level supply current vs. ambient temperature fig.19 high level supply current vs. supply voltage fig.16 low level output voltage vs. ambient temperature fig.17 low level output voltage vs. supply voltage low level output voltage v ol (v) 0.05 0.1 0.15 0.2 0.25 0 ? 40 ? 20 0 40 20 100 80 60 ambient temperature t a ( ? c) i f = 0ma, i o = 0.1a, v cc = 30v low level output voltage v ol (v) 0.25 0 0.05 0.1 0.15 0.2 15 20 30 25 supply voltage v cc (v) t a = 25 ? c, v f = 0.8ma, i o = 0.1a high level supply current i cch (ma) 0.5 1 1.5 2 2.5 3 3.5 0 ? 40 ? 20 0 40 20 100 80 60 ambient temperature t a ( ? c) i f = 16ma, v cc = 30v high level supply current i cch (ma) 0.5 1 1.5 2 2.5 3 3.5 0 15 20 25 30 supply voltage v cc (v) t a = 25 ? c, i f = 16ma high level supply current i ccl (ma) 0.5 1 1.5 2 2.5 3 3.5 0 ? 40 ? 20 0 40 20 100 80 60 ambient temperature t a ( ? c) i f = 0ma, v cc = 30v low level supply current i ccl (ma) 0.5 1 1.5 2 2.5 3 3.5 0 15 20 25 30 supply voltage v cc (v) t a = 25 ? c, i f = 0ma
12 sheet no.: d4-a09301en PC925L0NSZ0F series remarks : please be aware that all data in the graph are just for reference and not for guarantee. fig.26 propagation delay time vs. ambient temperature fig.24 output voltage vs. supply voltage (uvlo threshold) fig.25 relative uvlo threshold vs. ambient temperature fig.22 "low high" relative threshold input current vs. ambient temperature fig.23 "low high" relative threshold input current vs. supply voltage relative threshold input current (%) 90 110 120 130 140 80 ? 40 ? 20 0 40 20 100 80 60 ambient temperature t a ( ? c) 100 100% at t a = 25 ? c v cc = 30v relative threshold input current (%) 90 110 120 130 140 80 ? 40 ? 20 0 40 20 100 80 60 supply voltage v cc (v) 100 100% at v cc = 30v t a = 25 ? c output voltage v o (v) 4 10 12 14 16 18 20 0 5678910 1314 11 12 20 18 19 15 16 17 6 8 2 t a = 25 ? c i f = 10ma supply voltage v cc (v) relative uvlo threshold (%) 90 95 105 110 115 120 80 ? 40 ? 20 0 40 20 100 80 60 ambient temperature t a ( ? c) 85 100 100% at t a = 25 ? c i f = 10ma v o >5v v uvlo + v uvlo ? 0 0.3 0.35 0.4 0.15 0.2 0.25 0.1 0.5 0.45 0.05 9 810 71113 12 14 16 15 propagation delay time t plh , t phl ( s) forward current i f (ma) v cc = 30v r l = 10 c g = 10nf t a = 100 ? c t a = 25 ? c t phl t a = ? 40 ? c t plh t a = ? 40 ? c t a = 100 ? c t a = 25 ? c
13 sheet no.: d4-a09301en PC925L0NSZ0F series design considerations recommended operating conditions parameter symbol min. max. unit input current (on) i f (on) 7 16 ma input voltage (off) v f (off) ? 3 0.8 v supply voltage v cc 15 30 v operating temperature t opr ? 40 100 ? c notes about static electricity transistor of detector side in bipolar con guration may be damaged by static electricity due to its minute de- sign. when handling these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics. design guide in order to stabilize power supply line, please certainly connect a by-pass capacitor of 0.1 f or more be- tween v cc and gnd near the device. in case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is oating capacitance may be generated and result in false operation since current may go through led or current may change. if the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of led. the detector which is used in this device, has parasitic diode between each pins and gnd. there are cases that miss operation or destruction possibly may be occurred if electric potential of any pin becomes below gnd level even for instant. therefore it shall be recommended to design the circuit that electric potential of any pin does not become below gnd level. this product is not designed against irradiation and incorporates non-coherent led. degradation in general, the emission of the led used in photocouplers will degrade over time. in the case of long term operation, please take the general led degradation (50% degradation over 5 years) into the design consideration. please decide the input current which become 2 times of max. i flh .
14 sheet no.: d4-a09301en PC925L0NSZ0F series recommended foot print (reference) smt gullwing lead-form 2.54 2.54 1.7 2.2 8.2 2.54 (unit : mm) wide smt gullwing lead-form 2.54 2.54 1.7 2.2 10.2 2.54 (unit : mm) ? for additional design assistance, please review our corresponding optoelectronic application notes.
15 sheet no.: d4-a09301en PC925L0NSZ0F series manufacturing guidelines soldering method re ow soldering : re ow soldering should follow the temperature pro le shown below. soldering should not exceed the curve of temperature pro le and time. please don't solder more than twice. 1234 300 200 100 0 0 ( ? c) terminal : 260 ? c peak (package surface : 250 ? c peak) preheat 150 to 180 ? c, 120s or less reflow 220 ? c or more, 60s or less (min) flow soldering : due to sharp ? s double transfer mold construction submersion in ow solder bath is allowed under the be- low listed guidelines. flow soldering should be completed below 270 ? c and within 10s. preheating is within the bounds of 100 to 150 ? c and 30 to 80s. please don ? t solder more than twice. hand soldering hand soldering should be completed within 3 s when the point of solder iron is below 400 ? c. please don ? t solder more than twice. other notice please test the soldering method in actual condition and make sure the soldering works ne, since the im- pact on the junction between the device and pcb varies depending on the tooling and soldering conditions.
16 sheet no.: d4-a09301en PC925L0NSZ0F series cleaning instructions solvent cleaning : solvent temperature should be 45 ? c or below. immersion time should be 3minutes or less. ultrasonic cleaning : the impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of pcb and mounting method of the device. therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. recommended solvent materials : ethyl alcohol, methyl alcohol and isopropyl alcohol in case the other type of solvent materials are intended to be used, please make sure they work ne in ac- tual using conditions since some materials may erode the packaging resin. presence of odc this product shall not contain the following materials. and they are not used in the production process for this product. regulation substances : cfcs, halon, carbon tetrachloride, 1.1.1-trichloroethane (methylchloroform) speci c brominated ame retardants such as the pbb and pbde are not used in this product at all. this product shall not contain the following materials banned in the rohs directive (2002/95/ec). ?lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated diphenyl ethers (pbde).
17 sheet no.: d4-a09301en PC925L0NSZ0F series package speci cation sleeve package package materials sleeve : hips (with anti-static material) stopper : styrene-elastomer package method max. 50pcs of products shall be packaged in a sleeve. both ends shall be closed by tabbed and tabless stoppers. the product shall be arranged in the sleeve with its anode mark on the tabless stopper side. max. 20 sleeves in one case. sleeve outline dimensions 12 6.7 5.8 10.8 520 2 (unit : mm)
18 sheet no.: d4-a09301en PC925L0NSZ0F series tape and reel package 1. smt gullwing lead-form package materials carrier tape : a-pet (with anti-static material) cover tape : pet (three layer system) reel : ps carrier tape structure and dimensions f k e i d j g b h a c dimensions list (unit : mm) a 16.0 0.3 b 7.5 0.1 c 1.75 0.10 d 12.0 0.1 e 2.0 0.1 h 10.4 0.1 i 0.40 0.05 j 4.2 0.1 k 10.2 0.1 f 4.0 0.1 g 1.5 + 0.1 ? 0 5 ? max. h reel structure and dimensions a c e g f b d dimensions list (unit : mm) a 330 b 17.5 1.5 c 100 1 d 13.0 0.5 e 23 1 f 2.0 0.5 g 2.0 0.5 direction of product insertion pull-out direction [packing : 1 000pcs/reel]
19 sheet no.: d4-a09301en PC925L0NSZ0F series tape and reel package 2. wide smt gullwing lead-form package materials carrier tape : a-pet (with anti-static material) cover tape : pet (three layer system) reel : ps carrier tape structure and dimensions f k e i d j g b h a c a 24.0 0.3 b 11.5 0.1 c 1.75 0.10 d 12.0 0.1 e 2.0 0.1 h 12.4 0.1 i 0.40 0.05 j 4.05 0.10 k 10.0 0.1 f 4.0 0.1 g 1.5 + 0.1 ? 0 5 ? max. dimensions list (unit : mm) h reel structure and dimensions a c e g f b d a 330 b 25.5 1.5 c 100 1 d 13.0 0.5 e 23 1 f 2.0 0.5 g 2.0 0.5 dimensions list (unit : mm) direction of product insertion pull-out direction [packing : 1 000pcs/reel]
20 sheet no.: d4-a09301en PC925L0NSZ0F series important notices the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of sharp's devices. contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the speci cations, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. manufacturing locations are also subject to change without notice. observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used speci ed in the relevant speci cation sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- of ce automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliability such as: --- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traf c signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment --- medical and other life support equipment (e.g., scuba). if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp devices. this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. contact and consult with a sharp representative if there are any questions about the contents of this publication. [e251]

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